MediaTek Launches Dimensity 9400 with 3.63 GHz Cortex-X925 Core
MediaTek has unveiled its latest flagship chipset, the Dimensity 9400, setting a new standard in smartphone performance and power efficiency. Built using TSMC’s advanced 3 nm N3E process, this chipset combines impressive processing power with cutting-edge AI and graphics capabilities, making it ideal for flagship devices.
CPU Powerhouse
At the heart of the Dimensity 9400 is a powerful 1+3+4 CPU architecture:
- One Cortex-X925 core clocked at 3.63 GHz for peak performance during the most demanding tasks.
- Three Cortex-X4 cores operating at up to 3.3 GHz, ensuring strong multi-threaded performance.
- Four Cortex-A720 cores running at 2.4 GHz, focused on delivering energy efficiency during less intense operations.
The combination of these cores leads to impressive gains:
- A 35% increase in single-core performance.
- 28% improvement in multi-core processing.
- A 15% boost in Instructions per Cycle (IPC), allowing the CPU to process more tasks per clock cycle, improving overall efficiency and speed.
Immortalis-G925 GPU
For graphics, the Dimensity 9400 is equipped with the Immortalis-G925 GPU, running at 1612 MHz. This GPU offers:
- A 41% increase in graphics performance over previous models.
- 40% faster ray tracing for more realistic lighting and reflections in gaming.
- 44% power savings, providing an enhanced gaming experience without sacrificing battery life.
AI Power with NPU 890
The NPU 890 is MediaTek’s latest AI processing unit, offering improved power efficiency and new features:
- It uses 35% less power than its predecessor, improving battery life in AI-heavy applications.
- The chipset includes real-time corrective fill for photos, enhancing clarity and sharpness.
- The AI can handle up to 100x zoom, delivering remarkable detail and image quality, even when zoomed in significantly.
- The NPU also helps optimize 4K video recording at 60fps, allowing smoother capture with less power usage.
Imaging 1090 ISP for Advanced Imaging
The Imagiq 1090 ISP (Image Signal Processor) is a standout feature of the Dimensity 9400, enabling advanced photo and video capabilities:
- HDR video can now be captured seamlessly across different zoom levels, ensuring consistent video quality even when switching between lenses.
- Improved processing allows for better video quality in challenging lighting conditions, making low-light video capture much more reliable.
Memory and Cache Enhancements
The Dimensity 9400 is the first chipset to support 10.7 Gbps LPDDR5X RAM, ensuring ultra-fast memory speeds for high-performance applications. Additionally:
- L2 cache has been doubled, and L3 cache increased by 50%, allowing the processor to quickly access frequently used data and instructions, improving overall speed and responsiveness.
Built on TSMC’s 3 nm Process
The chipset is built on TSMC’s 3 nm N3E process, which delivers both performance and power efficiency gains. The smaller process technology reduces power consumption, leading to longer battery life and better thermal performance in devices that use the Dimensity 9400.
First Devices to Feature Dimensity 9400
MediaTek’s new flagship chipset is already being shipped to smartphone manufacturers, with two major releases expected:
- vivo X200 series, slated for launch in October 2024.
- Oppo Find X8, expected in November 2024.
These devices will highlight the full range of features the Dimensity 9400 has to offer, from cutting-edge performance to advanced AI and imaging capabilities.
Conclusion
The MediaTek Dimensity 9400 sets a new benchmark for flagship smartphone processors, offering substantial improvements in both performance and efficiency. With its high-performance CPU and GPU, advanced AI features, and support for the latest memory technologies, the Dimensity 9400 is ready to power the next generation of high-end smartphones.